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and other methods of measuring electrostatic parameters
This document is an overview of the structure and contents of a suite of documents representing an application framework for the Computer Integrated Manufacturing (CIM) systems as used in semiconductor factories
2 — Guide for the Qualification of Polymer Assemblies Used for Liquid Chemical Systems in Semiconductor Equipment
SEMI MF397 — Test Method for Resistivity of Silicon Bars Using a Two-Point Probe
It describes the concepts of material processing
G00800 - SEMI G8 - Test Method for Gold Plating StdPbc-0418 and other methods of measuringNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Test Method describes procedures to determine gold plating quality. These methods apply to gold plating on cofired ceramic or metal packages. The grade, hardness, and thickness of the gold plating shall be specified
