3D01200 - SEMI 3D12 - Guide for Measuring Flatness and Shape of Low Stiffness Wafers StdTpc-300 mm Packaging This standard does not purport

This standard does not purport to address safety issues

previously published in 1996

本仕様は，0

org in November 2014

97% Quality

3D01200 - SEMI 3D12 - Guide for Measuring Flatness and Shape of Low Stiffness Wafers StdTpc-300 mm Packaging This standard does not purport1 Purpose 1. 1 The control of parameters, such as thickness, total thickness variation (TTV), bow, warp, and flatness, is well known to be essential to many, if not all, semiconductor processes as reflected in a number of existing standards. 1. 2 The general trend in wafer geometry is to a larger diameter but even so the thickness increases correspondingly, it may not be enough to sustain adequate stiffness of the wafer. With growing aspect ratio of a