G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdPbc-1112 4-0424 (technical revision)

4-0424 (technical revision)

この仕様書は，SEMI E54の主要な部分である，共通デバイスモデル（CDM）と規定済みの特定デバイスモデル（SDM）との関係を定義する。この仕様書は，CDMの仕様書といくつかのSDMの仕様書，およびMECHATROLINKで公開されている仕様書と合わせて使用される。

1-0414 — Specification for SOAP Binding for Equipment Self Description (EqSD)

The purpose of this Standard is to provide an interface specification that replaces conventional electrical interface with a network connection and adds data communication capability

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G09800 - SEMI G98 - Specification for Coefficient of Thermal Expansion (CTE) of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdPbc-1112 4-0424 (technical revision)Mold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of