C10300 - SEMI C103 - Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks Used in Semiconductor Manufacturing Revision:SEMI C103-1021 - Current 1 The purpose of this

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C10300 - SEMI C103 - Guide for Reporting Performance Parameters of the Chemical Mechanical Planarization (CMP) Conditioning Disks Used in Semiconductor Manufacturing Revision:SEMI C103-1021 - Current 1 The purpose of thisThis Guide provides measurements and reporting of the parameters of disk aggressiveness, pad surface topography, disk surface topography and changes of the geometry of the disk features that are in contact with the pad during conditioning. This Guide provides measurements and reporting of the changes of aggressiveness and surface topography during the pad conditioning. This Guide provides for optimal sequence of the conditioning tests for multiple