G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Revision:Default Title Process and quality control during

Process and quality control during manufacturing of wafers requires continuous monitoring of waviness with a noncontact method that supports high throughput

previous published revision February 1998

blind vias

注意：　「注」の表題のついた段落は，本文書の公式な一部ではなく，また本文書の内容の変更や書き換えを意図したものではない。

SEMI T16-0310 (Reapproved 0322)

G05400 - SEMI G54 - Specification for Dimensions and Tolerances Used to Manufacture Molded Plastic Packages Revision:Default Title Process and quality control duringThis document is a guideline for ordering the tooling required to manufacture plastic semiconductor packages. These packages include the following JEDEC registered outlines: Plastic Dual in Line Packages (PDIP); Plastic Leaded Chip Carrier (PLCC); Plastic Quad Flat Packages (PQFP); Small Outline I. C. Packages (SOIC Gull Wing and "J" lead); and Plastic TAB Quad Packages (PTAB)Title. Referenced SEMI Standards SEMI G48 Specification, Measurement Method