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A sample data format for the test chip can be found in Appendix 1
orgで入手可能となる。初版は2000年10月発行。
SEMI MS2 — Test Method for Step Height Measurements of Thin Films
テストウェーハ（SEMI M8参照）
they describe the Modbus/TCP protocol
G01900 - SEMI G19 - Specification for Dip Leadframes Produced by Etching Revision:SEMI G19-0997 (Reapproved 0811) - Inactive A sample data format forNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification is a guideline for production of DIP leadframes for plastic molded semiconductor packages produced by the etching process. It is a design guideline for packaging engineers, etchers, and mold manufacturers
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