G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Revision:Default Title It defines the view of

It defines the view of the equipment through the SECS II link

SEMI C20-0213 (technical revision)

and measurement transfer functions

SEMI M65 — Specifications for Sapphire Substrates to Use for Compound Semiconductor Epitaxial Wafers

certain individual impurity species sometimes can be identified under very restricted conditions

G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Revision:Default Title It defines the view ofThis specification defines the standard requirements for co fired ceramic fine pitch chip carrier constructions, including both top brazed leaded and top metallized leadless configurations. These constructions are for hermetic packaging of various devices, (e. g., high speed, digital VLSI silicon devices), and next level interconnection to printed wiring assemblies and modules by either lead solder attachment or by "leads last" techniques. Referenced