G06900 - SEMI G69 - リードフレームとモールディングコンパウンド間の接着強度の測定の試験方法 Revision:SEMI G69-0996 (Reapproved 0811) - Superseded SEMI D61-1110 (first published)

Name: G06900 - SEMI G69 - リードフレームとモールディングコンパウンド間の接着強度の測定の試験方法 Revision:SEMI G69-0996 (Reapproved 0811) - Superseded SEMI D61-1110 (first published)
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Description

SEMI D61-1110 (first published)

a much tighter specification of the edge profile is required to control variations in subsequent circuit processing

SEMI E132-0922 (designation update)

This Standard addresses the communications needs of the semiconductor manufacturing facility with respect to material movement

SEMI E40-1102 (technical revision)

G06900 - SEMI G69 - リードフレームとモールディングコンパウンド間の接着強度の測定の試験方法 Revision:SEMI G69-0996 (Reapproved 0811) - Superseded SEMI D61-1110 (first published)global Assembly & Packaging Technical Committee201171global Audits and Reviews Subcommittee20118www. semiviews. org www. semi. org1996200411 : Referenced SEMI Standards None.

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