G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer StdPbc-0611 保護されるべき資産（装置情報資産）

保護されるべき資産（装置情報資産）

SEMI MF1727-1110 (Reapproved 0322)

consumer가 각각의 목적에 따라 관련된 데이터를 그룹화 하는 메커니즘을 포함한다

The level of agreement can vary depending on the degree of precision claimed for the moisture standard

This Document applies only to nitrogen gas and argon gas delivered through pipelines

G08700 - SEMI G87 - Specification for Plastic Tape Frame for 300 mm Wafer StdPbc-0611 保護されるべき資産（装置情報資産）The purpose of this Document is to standardize the specification of a plastic tape frame, for a 300 mm wafer, which is used between the dicing process and the die bonding process, and for the handling and shipping of wafers. This Specification is applicable to plastic tape frames for 300 mm wafers. This Standard puts in writing the dimensions, mechanical characteristics and measurement method for the 300 mm wafer tape frame. This Standard can be used