G05600 - SEMI G56 - Test Method for Measurement of Silver Plating Thickness StdPbc-0723 注意: 本文書は，編集上の修正を伴い，再承認された。

注意: 　本文書は，編集上の修正を伴い，再承認された。

a much tighter specification of the edge profile is required to control variations in subsequent circuit processing

This Test Method can be applied to single crystals of silicon in circular wafer form

SEMI E99-0623 (technical revision)

005 Ω·cm

G05600 - SEMI G56 - Test Method for Measurement of Silver Plating Thickness StdPbc-0723 注意: 本文書は，編集上の修正を伴い，再承認された。1 Purpose 1. 1 Use This Test Method may be used for process control and outgoing inspection at the supplier or by the customer for incoming inspection. 1. 2 Units This Test Method uses SI units. 2 Scope 2. 1 This Test Method describes the standard method for measuring the thickness of silver plating on semiconductor leadframes. Referenced SEMI Standards (purchase separately) None. Revision History SEMI G56 0318 (technical revision) SEMI G56 93